• Package:  white SMT package, colorless clear resin
• Feature of the device:  small package for applications where small space is required
• Color:  yellow (587 nm)  
• Viewing angle at 50 % I_V:  120 ° 
• Technology:  InGaAlP  
• Assembly methods:  suitable for all SMT assembly methods
• Packing unit:  8 mm tape with 3000 pcs. on Ø 180 mm reel  
• ESD - withstand voltage:  2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

Parameter List