880nm emitter in plastic package
Related Product Groups
SFH 4845 mm (T1 ¾) Plastic Package, Half Angle ±8 and ±20°, UL version available |
SFH 485 P5 mm (T1 ¾) Plastic Package, Half Angle ±40 °, UL version available |
SFH 4865 mm (T1 ¾) Plastic Package, Half Angle ±11°, UL version available |
SFH 4873 mm (T1) Plastic Package, Half Angle ±20 °, UL version available |
SFH 487 P3 mm (T1) Plastic Package, Half Angle ±65 ° |
SFH 4855 mm (T1 ¾) Plastic Package, Half Angle ±8 and ±20°, UL version available |
Additional Documentation and Information
| Document Type | Title | Date | File Type | File Size |
|---|---|---|---|---|
| Application Note |
Manual Lead-free Soldering of LEDs from OSRAM Opto Semiconductors In addition to a brief fundamental consideration of the manual lead-free and lead-containing soldering process, this application note...
Manual Lead-free Soldering of LEDs from OSRAM Opto Semiconductors
In addition to a brief fundamental consideration of the manual lead-free and lead-containing soldering process, this application note describes the essential influencing factors and their effect on the lead-free soldering process. Furthermore, the basic rules and specific guidelines associated with the new manual lead-free soldering process are illustrated. Also, possible risks are discussed and the general procedure of the lead-free soldering process is described. In conclusion an overview of the solderability of the various LED types from OSRAM Opto Semiconductors are presented, along with their ability to be reworked and repaired. |
2013-03-01 | 503 KB | |
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| Application Note |
Cleaning of LEDs Various cleaning methods for LEDs are described in this Application Note: Dry cleaning. wet cleaning, ultrasonic cleaning. |
2007-12-01 | 42 KB | |
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| Application Note |
Processing of OSRAM Opto Semiconductors LEDs This application note shows how radial and SMT LEDs can be processed, from the initial tape or reel to the soldering process. |
2005-02-10 | 455 KB | |
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