In addition to a brief fundamental consideration of the manual lead-free and lead-containing soldering process, this application note describes the essential influencing factors and their effect on the lead-free soldering process.

Furthermore, the basic rules and specific guidelines associated with the new manual lead-free soldering process are illustrated.

Also, possible risks are discussed and the general procedure of the lead-free soldering process is described.

In conclusion an overview of the solderability of the various LED types from OSRAM Opto Semiconductors are presented, along with their ability to be reworked and repaired.

This application notes gives an overview about IR-based touchscreen technologies with a special focus on infrared emitting diodes and photo detectors to be used in such applications.

This application note describes the possible hazards of infrared LEDs (IREDs) used for lamp applications with respect to the IEC-62471 standard and how to classify IREDs according to different risk groups

Various cleaning methods for LEDs are described in this Application Note: Dry cleaning. wet cleaning, ultrasonic cleaning.

As LEDs become more efficient and more compact their sensitivity to ESD events is also increasing in the majority of cases. Despite a great deal of effort in the semiconductor industry in the past decade, ESD still affects production yields, manufacturing costs, product quality, product reliability, and profitability of all semiconductor devices, including LEDs.

This application note shows how radial and SMT LEDs can be processed, from the initial tape or reel to the soldering process.