• Package:  white SMT package with clear silicone lens chip level conversion
• Luminous Flux:  60 lm at 400 mA up to 129 lm at 1000 mA  
• Feature of the device:  high efficient lightsource at low space
• Color:  red (623 nm)  
• Viewing angle at 50 % I_V:  170 ° 
• Technology:  InGaAlP Thinfilm  
• Optical efficiency (max.):  79 lm/W at 100 mA  
• Assembly methods:  suitable for all SMT assembly methods
• Packing unit:  24 mm tape with 200 pcs. on Ø 180 mm reel, 1200 pcs. on Ø 330 mm reel  
• ESD - withstand voltage:  8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)

Parameter List