LY T64F
TOPLED Black, yellow (Y), black PLCC-2 package, colorless diffused resin, viewing angle 30°
Features
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Related Product Types
| Product Type | Description | Ordering No. | ||
|---|---|---|---|---|
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LY T64F-BBDA-35-1 | TOPLED W. LENS, yellow (590 nm) |  |
Q65111A0257 |
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LY T64F-CADB-46-1 | TOPLED W. LENS, yellow (590 nm) | |
Q65111A0258 |
Product Parameters
Parameter Listwith electrical and technical characteristics |
Additional Documentation and Information
| Document Type | Title | Date | File Type | File Size |
|---|---|---|---|---|
| Datasheet | LO_LR_LY_T64F - TOPLED Black | 2012-12-17 | 2250 KB | |
| Application Note |
Measuring of the Temperature Profile during the Reflow Solder Process With reference to the application note „Further Details on lead free reflow soldering of LEDs” the present note provides...
Measuring of the Temperature Profile during the Reflow Solder Process
With reference to the application note „Further Details on lead free reflow soldering of LEDs” the present note provides details and recommendations for measuring of the temperature profile during the lead-free reflow solder process. Beside general information about thermocouples the critical selection of suitable measuring points is described, as well as different possibilities for the attachment introduced.  |
2010-08-01 | 291 KB | |
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| Application Note |
LED driving technology for long term flexibility In order to guarantee constant brightness for LED illumination systems with long product cycle times, the availability of LEDs with constant...
LED driving technology for long term flexibility
In order to guarantee constant brightness for LED illumination systems with long product cycle times, the availability of LEDs with constant brightness within the product cycle is often still required or expected. This application note is intended to show that in spite of the continuous further development of LED technology, the issue can be avoided or completely eliminated with a simple solution. |
2010-07-01 | 496 KB | |
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| Application Note |
Thermal Management of SMT LED To achieve reliability and optimal performance of LED Light sources a proper thermal management design is necessary. Like all electronic...
Thermal Management of SMT LED
To achieve reliability and optimal performance of LED Light sources a proper thermal management design is necessary. Like all electronic components, LEDs have thermal limitations. The allowed operation temperature for the specific lifetime is limited by the glass-point of the LED resin. Usually the maximum permissible junction temperature of common SMT LEDs is in the range of 95 - 125 °C. This means that the temperature of the die inside, doesnít have to exceed this value when exposed to the expected operation temperature. This brief will give the design engineer an introduction in the thermal basic of SMT LEDs. Furthermore, some concepts are shown in order to improve the thermal design. |
2010-03-01 | 208 KB | |
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| Application Note |
Reliability and Lifetime of LEDs This application note provides a fundamental insight into the matters of "reliability" and "lifetime". The terms lifetime and reliability...
Reliability and Lifetime of LEDs
This application note provides a fundamental insight into the matters of "reliability" and "lifetime". The terms lifetime and reliability are explained in further detail with respect to light emitting diodes (LEDs) and how these terms are understood by OSRAM Opto Semiconductors. In addition, important factors which influence the lifetime and reliability of LEDs are described. The Appendix provides descriptions of the mathematical foundations that are needed in practice. |
2008-07-01 | 712 KB | |
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| Application Note |
Comparison of LED Circuits In recent years, Light Emitting Diodes (LEDs) have become a viable alternative to conventional light sources. The overriding advantages long...
Comparison of LED Circuits
In recent years, Light Emitting Diodes (LEDs) have become a viable alternative to conventional light sources. The overriding advantages long life, high efficiency, small size and short reaction time have lead to the displacement, in ever increasing numbers, of incandescent bulbs. One of the markets where this change has become most evident is Automotive, where LEDs are used now not only for backlighting dashboards and switches, but also for exterior illumination in Center High Mounted Stop Lights (CHMSL), Rear Combination Lamps (RCL), turn signals and puddle lighting. Despite the long life and low failure rates of LEDs, cars can be found, on occasion, with failed LEDs in their CHMSL. Most often this is due to a flawed circuit design wherein the LEDs were allowed to be overdriven. It is with that supposition in mind that this application note is written: to identify, characterize and comment on LED behavior and failure modes in serial and matrix circuits. |
2004-05-03 | 87 KB | |
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| Application Note |
Thermal consideration of LEDs in video display applications The purpose of this application brief is to show a method to determine the maximum permissible power dissipation of the LEDs in a display...
Thermal consideration of LEDs in video display applications
The purpose of this application brief is to show a method to determine the maximum permissible power dissipation of the LEDs in a display application, and allow the junction temperature (TJ) to remain below its rated value. Junction refers to the p-n junction within the LED. |
2004-02-02 | 1834 KB | |
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| Application Note |
Dimming InGaN LEDs The first true ancestors to the Indium Gallium Nitride (InGaN) LED evolved last decade. These took the form of blue LEDs utilizing Silicon...
Dimming InGaN LEDs
The first true ancestors to the Indium Gallium Nitride (InGaN) LED evolved last decade. These took the form of blue LEDs utilizing Silicon Carbide (SiC) as the active, light-emitting material. These early LEDs were characterized by very low light output, less than 2cd/m2. The next generation of blue LEDs relied upon SiC as a base layer only and employed Gallium Nitride (GaN), grown directly on the SiC substrate, as the active, light-emitting epitaxial layer. This process initially increased light output by a factor of eight. The final iteration saw the introduction of Indium (In) to the epitaxial layer to form InGaN. This development further boosted light output by a factor of five - a full 1300% increase in intensity over the first SiC LEDs. Today, through advances in process, packaging and thermal transfer technologies, light output continues to evolve. Besides increasing the intensity of blue, and by extension, white LEDs (since all white LEDs use a blue chip in conjunction with a light converter, or phosphor), the InGaN process has replicated two new colors: verde and true green. These unique colors, alongside InGaN’s high intensity and inherent reliability, has greatly increased their proliferation into applications once reserved solely for incandescent lighting: traffic signals, realcolor displays, message boards, moving signs, dashboard backlighting, battery flashlights and toys. While the InGaN process produces the brightest light output across blue, verde, true green and white, it is important to understand that the wavelength of the light emitted is strongly dependent upon the forward current driven through the device, and that in order to avoid shifts in color, careful consideration must be paid to dimming strategies. This application note, then, will examine methods for dimming InGaN LEDs with little or no effect on wavelength. |
2003-01-08 | 150 KB | |
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| Application Note |
Surface Mount LED Applications SMT Replaces Through Hole Technology. The use of SMT-TOPLED varies greatly from the use of traditional through hole LEDs. Historically...
Surface Mount LED Applications
SMT Replaces Through Hole Technology. The use of SMT-TOPLED varies greatly from the use of traditional through hole LEDs. Historically through hole LEDs have been incorporated directly into front panels using the leads as a stand off. Due to the automated nature of SMT assembly, and the size constraints of SMT components and assemblies, SMT-TOPLED applications are different from through hole applications. |
2002-06-26 | 206 KB | |
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| Application Note |
Surface Mounting What is Surface Mounting? In conventional board assembly technology the component leads are inserted into holes through the PC board and...
Surface Mounting
What is Surface Mounting? In conventional board assembly technology the component leads are inserted into holes through the PC board and connected to the solder pads by wave soldering on the reverse side (through-hole assembly). In hybrid circuits (thick and thin film circuits) ìchipsî, i.e. Ieadless components, are reflow soldered onto the ceramic or glass substrate in addition to the components already integrated on the substrate. Surface mounting evolved from these two techniques. |
2002-06-06 | 186 KB | |
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